Semiconductor characteristics and geometry - of p-n junctions improvement

摘要

Semiconductor slices which have been subjected to the normal mechanical handling processes such as lapping and polishing are then further cleaned to remove enough material from each slice that all impurities introduced by the mechanical processes are removed before that treatment takes place. It may be carried out chemical etch polishing, or approx. 20mu m may be ground from each side using corundum or silicon carbide and diamond paste.