| 摘要 |
PURPOSE:To prevent attachment of metal powder and dust and to prevent damages and the like due to the collision against other bodies by coating the bonding part between the IC chip and tape carrier on the thermal head device and the IC chip by a flexible resin, and further providing a protective cover. CONSTITUTION:On the thermal head device, heating resistors 4 on a ceramic substrate 2 and conducting wires 7 on the driving side on a glass epoxy substrate 3 are connected by tape carriers 8, and an IC chip 20 on which a driving transistor array and a shift register are incorporated are mounted on each tape carrier 8. Said tape carrier 8 is cut by a wire 15 which passes openings 10 and 12. A terminal part 13a is bonded to an electrode 5 on the substrate 2. Meanwhile a terminal part 14b is bonded to the conducting wires 7 on the substrate 3. Lead terminals 21 of the IC chip 20 are bonded to terminal parts 13b and 14a of the conducting wires 13 and 14 by the bonding parts 22. The IC chips 20 and the bonding parts 22 are coated by the flexible resin. A protecting cover 25 which covers the tape carrier 8 is further attached. |
