| 摘要 |
PURPOSE:To remove foreign particles without damaging the surface of a wafer by a method wherein a piece of cloth moistened with water is held in running water and a moving part, which can be pressed to the surface of a semiconductor substrate and can sweep the surface, traces the surface at a speed of less than two times per second. CONSTITUTION:A nonwoven fabric 4 is wound around a strut 5. The strut 5 is connected to a driving part 7, which slowly moves in the right and left directions, via a coupling 6; accordingly, when the driving part 7 moves in the right and left directions, the strut 5 is slowly shifted upward and downward in parallel with the surface of a wafer. During this process, pure water washes away the surface of the wafer; the nonwoven fabric moves forward and backward at about three times per five seconds in such a way that the nonwoven fabric is pressed to the surface of the wafer. By this method, it is possible to detach a foreign substance, which has adhered to the surface of a semiconductor substrate, from the surface and to wash it away in running water without damaging the surface of the semiconductor substrate.
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