发明名称 |
Thermosetting resin and prepreg and laminate using the same |
摘要 |
A thermosetting resin composition comprising a special poly(p-hydroxystyrene) derivative resin and a radical polymerization initiator, and if necessary an epoxy modified polybutadiene, can provide prepregs and laminates having a low dielectric constant, a shorter signalling delay time, good heat resistance and flame retardancy and thus being suitable for producing multilayer printed circuit boards.
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申请公布号 |
US4886858(A) |
申请公布日期 |
1989.12.12 |
申请号 |
US19870015325 |
申请日期 |
1987.02.17 |
申请人 |
HITACHI, LTD. |
发明人 |
KATAGIRI, JUNICHI;NAGAI, AKIRA;TAWARA, KEIKO;TAKAHASHI, AKIO;WAJIMA, MOTOYO;NARAHARA, TOSHIKAZU;HIRAGA, RYO |
分类号 |
C08L25/04;C08F8/00;C08F12/22;C08F290/12;C08F299/00;C08G59/34;C08L63/08;H05K1/03 |
主分类号 |
C08L25/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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