| 摘要 |
PURPOSE: To improve a signal-to-noise ratio and high frequency performance of packaging and to improve a yield by providing a lead frame containing a conductive element for supplying power signals and ground signals to a semiconductor chip and a decoupling capacitor attached to the power conductive element and ground conductive element of the lead frame so as to eliminate electric noise. CONSTITUTION: This lead frame assembly provided with a conductive element 12 in which a solder bump 16 used for interconnecting the lead frame to an electronic device is formed beforehand is provided. It is preferable that the lead frame 10 is provided with at least one of the power conductive element, the ground conductive element and a signal conductive element so as to send input signals and output signals to a joined part on the electronic device 20. The process of forming the solder bump 16 beforehand is provided with the process of providing an unsolderable transfer substrate 20. The transfer substrate 20 is provided with a transfer surface 22 for receiving a solder material in the shape of the solder bump, that is a deposit 16. The solder material is stuck to the transfer surface 22 so as to form a solder deposit in a prescribed pattern. Then, the conductive element 12 of the lead frame 10 is aligned to the bump 16 and engaged. |
