| 摘要 |
PROBLEM TO BE SOLVED: To polish a wafer with a larger bore into high quality by transferring a plurality of polished body holding means and polishing body capacity recovery means provided on the same plane, in regular order to a treatment station provided on a polishing head. SOLUTION: After the completion of polishing a wafer 100 conveyed into a treatment station by a transfer means 101, by a rough polishing head 105 and a rough polishing pad 111, the wafer 100 is conveyed out of the treatment station by the transfer means 101, and a polishing pad conditioner is arranged in the treatment station instead. As the polishing pad conditioner 104, a member with diamond or the like dispersed as abrasive grains in the face coming in contact with the polishing pad is used and brought into sliding-rubbing contact with the rough polishing pad 111 to recover polishing capacity. After the rough polishing pad 111 is recovered into an appropriate state, the polishing pad conditioner 104 is conveyed out of the treatment station, and another wafer 100 is conveyed into the treatment station and polished. |
