发明名称 PRINTED WIRING BOARD
摘要 A printed wiring board for forming an electric connection to an external device. The printed wiring board comprises a base material, and at least one connecting terminal formed on the base material for forming an electrical connection to an external device. A solder resist layer is formed on at least a portion of the base material surface excluding a connecting terminal forming region. A conductive protective layer is formed over the connecting terminal forming region and covers the connecting terminal. The end portion of the solder resist layer is separated from the end portion of the conductive protecting layer. An overcoat layer is formed on the separating portion for bridging the end portion of the solder resist layer and the end portion of the conductive protecting layer.
申请公布号 GB9208537(D0) 申请公布日期 1992.06.03
申请号 GB19920008537 申请日期 1992.04.21
申请人 NIPPON CMK CORP. 发明人
分类号 H05K1/11;H05K3/24;H05K3/28;H05K3/34;H05K3/40 主分类号 H05K1/11
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