| 摘要 |
PURPOSE:To make it possible to be electrically conductive without exerting an influence such as a punch on another layer, by providing a through hole at a compensatory position of a prepreg material to be conductive between inner layer circuit patterns and performing polymerization/hardening by applying pressure/heat to the prepreg material. CONSTITUTION:A hole H0 is provided at a part in which conduction between both circuit patterns is made in a prepreg material P insulating/adhering a second and third layers L2 and L3 of an inner layer. As means for making conduction, a conductive material T is filled as much as required in the inside. In this state, when the both layers adheres by compressing by heat a double faced printed board B2 and performing polymerization/hardening on the prepreg material P, a hole H0 is filled with the filled paste T by compression and it is in contact with the patterns L2 and L3 to be conductive. As a result, it is possible not to exert an influence such as a punch on another layer. |
