发明名称 Cover member for sealed circuit board assembly
摘要 A multi-layered laminate structure forms a cover member that is capable of being sealed around the edges of a circuit board, around connector assemblies mounted on the circuit board, and against a mounting panel to which the circuit board is attached, to provide a sealed environment for electrical components mounted on the circuit board.
申请公布号 US5867371(A) 申请公布日期 1999.02.02
申请号 US19970939540 申请日期 1997.09.29
申请人 ERICSSON INC. 发明人 DENZENE, QUENTIN S.;NEALIS, EDWIN J.
分类号 H05K3/28;H05K5/06;H05K9/00;(IPC1-7):H05K9/00 主分类号 H05K3/28
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