| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an inspection jig capable of obtaining a sufficient contact force between a body to be inspected and the inspection jig in the case of inspecting bodies to be inspected after dicing and separation and in the case of inspecting semiconductor ships and semiconductor devices in a wafer state as well and to provide a method for manufacturing the same. SOLUTION: A semiconductor inspection is constituted of an inspecting electrode 13 to come into contact with a body to be inspected at its surface, a relay electrode 14 provided at a distance from the inspecting electrode 13, a wire 15 to connect the back surface of the inspecting electrode 13 electrically to the relay electrode 14, and an elastic insulator 18 to perform coating so as to include the wire 15.</p> |
