| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor element housing package, wherein the inside of a vessel is perfectly sealed airtight while a semiconductor element housed in the vessel is always kept at an appropriate temperature, so that the semiconductor element operates normally and stably over a long period. SOLUTION: A heat radiating plate 8 is fitted to the outside surface of an insulating vessel 4, comprising a metalized wiring layer which, formed of a mullite sintered body or glass ceramics sintered body, comprises a vacant space for housing a semiconductor element inside and connected to the electrode of the semiconductor element. Here, related to the heat radiating plate 8, a metal layer 9 of 3-layer structure comprising an adhesive layer 9a of titanium, zirconium, or vanadium, or at least one kind of alloy comprising them as main component, an intermediate layer 9b of copper, and a main layer 9c of molybdenum is coated on both upper and lower surfaces of a core body 8a of unidirectional composite material, wherein the carbon fibers arrayed in the thickness direction are combined with carbon and the thicknesses of the adhesive layer 9a, intermediate layer 9b, and main layer 9c are almost identical. |
