| 摘要 |
PROBLEM TO BE SOLVED: To simply fill non-penetrating holes by, after supplying insulating resin to the surface of a substrate, compressing it toward the bottom of the non-penetrating holes and thereby solidifying it. SOLUTION: A compressing body 30 made of rigid material has its portion corresponding to insulating resin 22 at an area on the surface of a substrate 10 where a non-penetrating hole 12 is exposed before the insulating resin 22 is supplied, formed into protruded shape. The compressing body 30 is brought into contact with the insulting resin 22, supplied to the surface of the substrate 10, under pressure. When the insulating resin 22 is compressed toward the bottom of the non-penetrating hole 12, form E remaining in the non-penetrating through hole 12 is pressed out, and the interior of the non-penetrating hole 12 is filled with the insulating resin 22. Then the insulating resin 22 is heated and solidified to form an insulating layer. Thus the interior of the non- penetrating hole is simply filled. |
