| 摘要 |
PROBLEM TO BE SOLVED: To prevent deformation of the leads of a resin-sealed semiconductor device by a method, wherein a plurality of the leads are fixed to nonconductive members at the outer edge of a sealing region for subjecting resin sealing the leads, and dummy leads are respectively arranged on the column ends of the columns of the plurality of the leads. SOLUTION: A lead frame consists of an Fe-Ni alloy, for example, or the like and a plurality of the leads 3 for signal are arranged extending over the whole periphery of a tab 2, which is mounted with a semiconductor chip 1. The leads 3 are integrally formed with nonconductive dam tapes 4. In addition to those ordinary leads 3, dummy leads 6 are respectively provided on the column ends of the columns of the leads 3. These dummy leads 6 are different from the ordinary leads 3, one end of each dummy lead 6 is connected with a tab suspension lead 7 for supporting the tab 2, and the other end of each dummy lead 6 is protruded slightly more than the other ends of the tapes 4. Accordingly, deformation of the leads 3 can be prevented in the manufacture of a semiconductor device using the tape dam system lead frame. |
