| 摘要 |
PROBLEM TO BE SOLVED: To prevent reduction in manufacturing yield due to the separation failure of a wafer from a tray by a method wherein, when a wafer is lifted up from the tray set in an unload part to transfer it, after an attractive force between the tray and the wafer is made weak, the wafer is lifted up. SOLUTION: In a tray 2 and an unload part 3, as a means for weakening the attracting force between a wafer 1 and a tray 2, there is formed an annular groove 9 along the inside of holes 7 passing a wafer projecting pin 5, which is provided at a side of the unload part 3 and is structured so as to be liftable on a wafer mounting face 6 of the tray 2. In order to couple with an opening part in a bottom part of the tray 2 of an air suction port 10 in which one end is opened in the bottom of the groove 9, an air inlet port 11 is formed at a position, corresponding to the other end of the air suction port 10 of the tray 2. In this manner, when the wafer 1 is taken out in a state in which the attractive force between the wafer 1 and the tray 2 is weakened, it is instructed so that the wafer projecting pin 5 is lifted up, thereby lifting up only the wafer 1. |
