| 摘要 |
An entire surface of a semiconductor substrate is coated with photoresist and baked. A circuit pattern area in the region excluding a peripheral region of the semiconductor substrate is subjected to normal exposure while a non-circuit area (photoresist remaining area) in the peripheral region of the semiconductor substrate is subjected to a weak light so that the photoresist will not be removed completely during a development step and the remaining photoresist will have a hydrophilic surface. This improves wettability for a developing solution, enabling to apply the developing solution uniformly over the semiconductor substrate surface. This in turn reduces irregularities of circuit pattern dimensions due to uneven development.
|
