SEMICONDUCTOR MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To make the temperature of a wafer uniform. SOLUTION: An auxiliary heater 3 for compensating for the decrease in the temperature of an end section 1A of a heater 1 is provided at the end section of at least the central side of the resistance heating type heater 1 where power is applied, or an auxiliary heater that is separate from the heater for compensating for the decrease in the temperature at the end section of the heater is connected to the end section of the resistance heating type heater where power is applied.