POROUS FILM AND CIRCUIT BOARD PREPREG

摘要

PROBLEM TO BE SOLVED: To obtain both a porous film having improved strength while maintaining a porous structure by forming a porous film using an aromatic polyamide blend body and a circuit board prepreg using the porous film. SOLUTION: This porous film comprises a blend body composed of (a) an aromatic polyamide containing a repeating unit of p-phenyleneterephthalamide as a copolymerization component and (b) an aromatic polyamide containing a repeating unit of m-phenyleneisophthalamide at least in a part and has 30-80% porosity.