| 摘要 |
An apparatus and method for drying substrates in single-wafer processing chambers by providing capillary material at those areas where the substrate contacts a rotatable support. The capillary material will draw in, by capillary force, any liquid that is trapped between the substrate and the support at the areas of contact, thus reducing the edge exclusion area of the substrate and increasing yield. The inventive apparatus, in one aspect, comprises: a rotatable support comprising a fixture for supporting a substrate in a substantially horizontal orientation by contacting only a perimeter region of a substrate; the fixture comprising one or more contact surfaces that contact and support the perimeter region of the substrate; and wherein the one or more contact surfaces comprise a capillary material.
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