Molded plastic ball grid array package

摘要

An improved leadless semiconductor device package consists of a molded plastic carrier (30) with a plurality of C5 bumps (52) integrally molded into the bottom side of the carrier. The bumps are made of the same plastic as the carrier and are monolithic to the carrier. The C5 bumps are coated with a solderable material (50) so that they can be connected to pads on a PCB with solder paste. The top side of the plastic carrier has a metallization pattern containing a plurality of bond pads (44) that correspond to pads on the semiconductor die, and the bond pads are electrically connected to the C5 bumps by an electrically conductive structure. A semiconductor die (38) is mounted on the carrier top side and electrically connected to the plurality of bond pads, either by wire bonds (54) or by flip chip bonding. C4 bumps (70) can also be molded into the carrier for flip chip attachment.