| 摘要 |
A printed-circuit board includes a shield pattern layer that is stacked on a surface layer with respect to at least one wiring pattern layer that includes a wide-pattern area having a wiring width of more than 1 millimeter. Moreover, the shield pattern layer includes a shield pattern that is, from a plane view, overlapped on the wide-pattern area, and grounded without being electrically connected to an internal layer of other wiring pattern layers.
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