| 摘要 |
An assembly is provided for regulating the temperature of and supporting a heating target such as semiconductor substrate or a metal/ceramic mold or other industrial processes that require temperature regulations such as degassing or annealing. In one embodiment, the assembly comprises a heating target support for supporting the heating target ; a ceramic heating element for heating the heating target to a temperature of at least 300° C.; a first thermally conductive layer disposed between the substrate support and the ceramic heating layer; a second layer disposed below the ceramic heating layer. Both the first layer and the second layer in the heater assembly have an elastic modulus of less than 5 GPa, for biasing the ceramic heating layer without causing damage to the ceramic layer while still providing uniform and excellent heating to the substrate.
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