| 摘要 |
A cured composition is prepared by curing a composition that includes an alkyl styrene and a low molecular weight, bifunctional poly(arylene ether). The curable composition can be prepared and processed at substantially lower temperatures than prior art poly(arylene ether) thermosets. The cured composition exhibits an improved balance of heat resistance, impact strength, and dielectric properties, making it particularly suitable for the fabrication of electronic components.
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