| 摘要 |
A polishing apparatus ( 1 ) has a polishing pad ( 22 ), a top ring ( 20 ) for holding a semiconductor wafer (W), a vertical movement mechanism ( 24 ) operable to move the top ring ( 20 ) in a vertical direction, a distance measuring sensor ( 46 ) operable to detect a position of the top ring ( 20 ) when a lower surface of the top ring ( 20 ) is brought into contact with the polishing pad ( 22 ), and a controller ( 47 ) operable to calculate an optimal position of the top ring ( 20 ) to polish the semiconductor wafer (W) based on the position detected by the distance measuring sensor ( 46 ). The vertical movement mechanism ( 24 ) includes a ball screw mechanism ( 30, 32, 38, 42 ) operable to move the top ring ( 20 ) to the optimal position.
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