发明名称 EXPOSURE APPARATUS, EXPOSURE METHOD AND LITHOGRAPHY SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide an exposure apparatus that suppresses a drop of throughput caused by missing of shot. SOLUTION: The exposure apparatus is equipped with a first exposure device 1 to expose the periphery of a wafer in maskless manner. The first exposure device is provided with: a light source 11 to emit light; a stage 20 on which a wafer 19 is placed; a rotary means 21 to turn the stage 20 wherein the wafer 19 is placed; and optical control means 13, 15 and 18 that are provided in the periphery of the wafer 19 placed on the stage 20 and control the shape, size, and a covering ratio of light 12 emitted from the light source 11 on the wafer 19. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008210877(A) 申请公布日期 2008.09.11
申请号 JP20070044163 申请日期 2007.02.23
申请人 TOSHIBA CORP 发明人 KONO TAKUYA;TOUKI TATSUHIKO
分类号 H01L21/027 主分类号 H01L21/027
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