SUBSTRATE TREATING EQUIPMENT AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To enhance throughput while using an inexpensive oxygen concentration measuring instrument by measuring the oxygen concentration of a load lock chamber under a state of reduced pressure in substrate treating equipment equipped with a load lock chamber. SOLUTION: The substrate treating equipment comprises a chamber 1 for treating a substrate 8, a spare chamber 2 connected airtightly to the treating chamber, an exhaust path 15 interconnected with the spare chamber and an exhaust means 13 and at least a portion of which can be isolated airtightly, and an oxygen concentration measuring means 14 connected to the isolable portion 18 of the exhaust path. COPYRIGHT: (C)2008,JPO&INPIT