发明名称 LOW-ADHESION MATERIAL, MOLD FOR SHAPING RESIN AND STAINPROOF MATERIAL
摘要 An upper die (1) has a cavity member (6) constituting an inner bottom surface (5) of a cavity (4), and a surrounding member (7). The cavity member (6) is formed of a low adhesion material in accordance with the present invention, and includes a body portion (8) and a surface layer (10) formed on an undersurface (9) of the body portion (8) exposed to a fluid resin. The body portion (8) is formed of a first material of 3YSZ and a second material of ZrN that are mixed at a predetermined ratio. The surface layer (10) is formed of Y 2 O 3 having a low adhesion property with respect to a set resin, and has a thermal expansion coefficient smaller than that of the body portion (8). By bonding the body portion (8) and the surface layer (10) at a high temperature and then cooling them down, compressive residual stress is caused in the surface layer (10) due to a difference in the thermal expansion coefficients thereof, and the compressive residual stress is present in the surface layer (10).
申请公布号 EP2006083(A2) 申请公布日期 2008.12.24
申请号 EP20060843408 申请日期 2006.12.27
申请人 TOWA CORPORATION;JAPAN FINE CERAMICS CENTER 发明人 KUNO, TAKAKI;NOGUCHI, YOSHINORI;MAEDA, KEIJI;KITAOKA, SATOSHI;KAWASHIMA, NAOKI
分类号 B29C33/56;B29C33/38;C04B37/00 主分类号 B29C33/56
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