发明名称 MODULE ASSEMBLY HAVING HEAT TRANSFER PLATE
摘要 A module assembly includes a component housing having a plurality of walls forming a cavity. At least one of the walls includes an opening therethrough open to the cavity. The heat transfer plate is mounted within the opening of the component housing and his exposed on an exterior of the component housing. The heat transfer plate forms at least a portion of a mounting surface of the component housing.
申请公布号 US2009103268(A1) 申请公布日期 2009.04.23
申请号 US20080252042 申请日期 2008.10.15
申请人 TYCO ELECTRONICS CORPORATION 发明人 BRYAN LYLE STANLEY;THRUSH ROGER LEE;IRLBECK ROBERT DANIEL;WORTHINGTON DONALD ROBERT
分类号 H05K7/20 主分类号 H05K7/20
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