发明名称 LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To prevent a decrease in productivity and in processing precision by accurately judging the suitability of galvano-scanner correction in laser processing.SOLUTION: A laser processing method for irradiating a substrate which is not a workpiece with laser from a laser oscillator by scanning with a galvano-scanner to drill a plurality of holes 10 in a lattice form, and for reading the images of the holes 10 with a camera to judge the suitability of galvano-scanner correction by processing image data from the camera is characterized by drilling a plurality of holes 10 for each crossing point region of the lattice, and by reading images of the plurality of holes 10 with the camera by using the crossing point region as a unit to statistically process positional data of the plurality of holes 10 obtained on the basis of the read image, so that the suitability of galvano-scanner correction is judged on the basis of comparison results obtained by the static processing with a reference value.SELECTED DRAWING: Figure 1
申请公布号 JP2016087660(A) 申请公布日期 2016.05.23
申请号 JP20140225908 申请日期 2014.11.06
申请人 VIA MECHANICS LTD 发明人 SUZUKI TERUHIKO;KIMURA FUMIAKI
分类号 B23K26/02;B23K26/00;B23K26/38 主分类号 B23K26/02
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