发明名称 半導体装置の製造方法、基板処理装置および半導体装置
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device including a metal film having a necessary work function and oxidation resistance at low cost.SOLUTION: A method of manufacturing a semiconductor device includes a step for forming a metal containing film having a structure, obtained by repeatedly laminating a metal nitride film and a metal film, on an insulation film formed on the surface of a substrate by alternately repeating formation of the metal nitride film and formation of the metal film. The metal nitride film is constituted of a substance whose oxidation resistance is higher than in the metal film, the metal film is constituted of the substance having a work function which is higher than in the metal nitride film, and in a step for forming the metal containing film, the metal nitride film is formed first.
申请公布号 JP5944549(B2) 申请公布日期 2016.07.05
申请号 JP20150063473 申请日期 2015.03.25
申请人 株式会社日立国際電気 发明人 堀井 貞義;小川 有人;板谷 秀治
分类号 H01L21/28;C23C16/34;C23C16/455;H01L21/285;H01L21/336;H01L21/822;H01L21/8242;H01L27/04;H01L27/108;H01L29/423;H01L29/49;H01L29/78 主分类号 H01L21/28
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