| 发明名称 | Low-dielectric resin composition and copper-clad laminate and printed circuit board using the same | ||
| 摘要 | The present invention provides a resin composition useful for a copper-clad laminate and a printed circuit board, wherein the resin composition comprises the following components: (A) 100 parts by weight of vinyl-containing polyphenylene ether resin; (B) 5 to 50 parts by weight of maleimide; (C) 10 to 100 parts by weight of styrene-butadiene copolymer; and (D) 5 to 30 parts by weight of cyanate ester resin. The present invention also provides a resin composition and an article made therefrom having low dissipation factor at high frequency and excellent thermal resistance and peeling strength and being useful for a copper-clad laminate and a printed circuit board. | ||
| 申请公布号 | US9402310(B2) | 申请公布日期 | 2016.07.26 |
| 申请号 | US201414170263 | 申请日期 | 2014.01.31 |
| 申请人 | Elite Electronic Material (Kunshan) Co., Ltd. | 发明人 | Wang Rongtao;Hsieh Chen Yu;Tian Wenjun;Ma Ziqian;LV Wenfeng |
| 分类号 | B32B27/00;H05K1/03 | 主分类号 | B32B27/00 |
| 代理机构 | Muncy, Geissler, Olds & Lowe, P.C. | 代理人 | Muncy, Geissler, Olds & Lowe, P.C. |
| 主权项 | 1. A resin composition comprising the following components: (A) 100 parts by weight of vinyl-containing polyphenylene ether resin; (B) 5 to 50 parts by weight of maleimide; (C) 10 to 100 parts by weight of styrene-butadiene copolymer; and (D) 5 to 30 parts by weight of cyanate ester resin. | ||
| 地址 | Kunshan, Jiangsu Province CN | ||