| 发明名称 |
SEMICONDUCTOR PACKAGING AND MANUFACTURING METHOD THEREOF |
| 摘要 |
The present disclosure provides a semiconductor package includes a contact pad, a device external to the contact pad and a solder bump on the contact pad. The device has a conductive contact pad corresponding to the contact pad. The solder bump connects the contact pad with the conductive contact pad. The solder bump comprises a height from a top of the solder bump to the contact pad; and a width which is a widest dimension of the solder bump in a direction perpendicular to the height. A junction portion of the solder bump in proximity to the contact pad comprises an hourglass shape. |
| 申请公布号 |
US2016218055(A1) |
申请公布日期 |
2016.07.28 |
| 申请号 |
US201615092256 |
申请日期 |
2016.04.06 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
发明人 |
LIN HSIU-JEN;LU WEN-HSIUNG;CHEN CHENG-TING;KUO HSUAN-TING;CHEN WEI-YU;CHENG MING-DA;LIU CHUNG-SHI |
| 分类号 |
H01L23/498;H05K1/11 |
主分类号 |
H01L23/498 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package, comprising:
a contact pad; a solder bump over the contact pad, wherein the solder bump comprises:
a height from a top of the solder bump to the contact pad; anda width which is a widest dimension of the solder bump in a direction perpendicular to the height, wherein a first junction portion of the solder bump in proximity to the contact pad comprises an hourglass shape. |
| 地址 |
Hsinchu TW |
