发明名称 Batch Heating and Cooling Chamber or Loadlock
摘要 Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber. Wafers are supported on a wafer lift which can move all wafers together or on independent lift pins which can move individual wafers for heating and cooling.
申请公布号 US2016218028(A1) 申请公布日期 2016.07.28
申请号 US201615001716 申请日期 2016.01.20
申请人 Applied Materials, Inc. 发明人 Schaller Jason M.;Vopat Robert Brent;Pergande Paul E.;Riordon Benjamin B.;Blahnik David T.;Weaver William T.
分类号 H01L21/673 主分类号 H01L21/673
代理机构 代理人
主权项 1. A wafer cassette comprising: a wall supporting a plurality of cold plates, the wall allowing access to a front side of at least some of the cold plates; a plurality of LED lamps positioned against a back side of the cold plates and having a front side spaced from a front side an adjacent cold plate to form a gap, the plurality of LED lamps directed toward the front side of the adjacent cold plate; and a wafer lift positioned to support a periphery of a wafer.
地址 Santa Clara CA US