发明名称 |
Batch Heating and Cooling Chamber or Loadlock |
摘要 |
Wafer cassettes and methods of use that provide heating a cooling to a plurality of wafers to decrease time between wafer switching in a processing chamber. Wafers are supported on a wafer lift which can move all wafers together or on independent lift pins which can move individual wafers for heating and cooling. |
申请公布号 |
US2016218028(A1) |
申请公布日期 |
2016.07.28 |
申请号 |
US201615001716 |
申请日期 |
2016.01.20 |
申请人 |
Applied Materials, Inc. |
发明人 |
Schaller Jason M.;Vopat Robert Brent;Pergande Paul E.;Riordon Benjamin B.;Blahnik David T.;Weaver William T. |
分类号 |
H01L21/673 |
主分类号 |
H01L21/673 |
代理机构 |
|
代理人 |
|
主权项 |
1. A wafer cassette comprising:
a wall supporting a plurality of cold plates, the wall allowing access to a front side of at least some of the cold plates; a plurality of LED lamps positioned against a back side of the cold plates and having a front side spaced from a front side an adjacent cold plate to form a gap, the plurality of LED lamps directed toward the front side of the adjacent cold plate; and a wafer lift positioned to support a periphery of a wafer. |
地址 |
Santa Clara CA US |