摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting a chip component, by which a chip component can be mounted simply surely effectively on a holding body like a socket. SOLUTION: In a method for mounting a chip component 1 having a plurality of electrodes 2 on a holding body like a socket 5 having electrodes 3 engaged with the electrodes 2 of the chip component, 1, the chip component 1 is stuck by an adhesive tape 11 to an auxiliary member frame 12 having a through hole 8, through which the socket 5 is inserted and the socket 5 is fitted and inserted into the frame 12 with at least one or more end surfaces of the chip component 1 engaged with the socket 5, whereby the chip component 1 is mounted on the socket 5 of the holding body. |