发明名称 METHOD FOR MOUNTING COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method for mounting a chip component, by which a chip component can be mounted simply surely effectively on a holding body like a socket. SOLUTION: In a method for mounting a chip component 1 having a plurality of electrodes 2 on a holding body like a socket 5 having electrodes 3 engaged with the electrodes 2 of the chip component, 1, the chip component 1 is stuck by an adhesive tape 11 to an auxiliary member frame 12 having a through hole 8, through which the socket 5 is inserted and the socket 5 is fitted and inserted into the frame 12 with at least one or more end surfaces of the chip component 1 engaged with the socket 5, whereby the chip component 1 is mounted on the socket 5 of the holding body.
申请公布号 JPH10303600(A) 申请公布日期 1998.11.13
申请号 JP19970108803 申请日期 1997.04.25
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 YAMAMOTO HAJIME;TAKESHITA HIROYUKI
分类号 H05K13/04 主分类号 H05K13/04
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