| 摘要 |
PROBLEM TO BE SOLVED: To provide, a method for packaging electronic component which can improve packaging accuracy irrespective of a packaging position on a circuit board. SOLUTION: This method identifies the positions of a plurality of target marks previously set on a circuit board (step 4), detects the amount of deviation of position of the circuit board on manufacturing the circuit board with reference to the identified position of the target mark nearest to the packaging position (steps 7, 8), and corrects the coordinate data of packaging positions of the electronic component based on the amount of deviation of position (steps 9 to 12). This can improve packaging accuracy irrespective of the packaging position on a circuit board. |
