ELECTRONIC DEVICE

摘要

Various embodiments of the present invention relate to a bonding member to bond components included in an electronic device. According to an embodiment of the present invention, the electronic device comprises: an external housing which includes a first plate and a second plate positioned in an opposite direction of the first plate; a structure which is positioned inside the external housing to be arranged between the first plate and the second plate and includes a first surface facing the first plate and a second surface facing the second plate; the components which are arranged among the first plate, the second plate, the first surface and the second surface of the structure; and a first tape member which is arranged among the structure and the components. The first tape member comprises: a first bonding layer in contact with at least a part of the component; a second bonding layer in contact with the first surface and the second surface; and a substrate arranged between the first bonding layer and the second bonding layer. Either the first bonding layer or the second bonding layer may include a material having adhesive force in a selected range in a selected temperature range. In addition, various other embodiments can be possible.