| 摘要 |
<p>1,216,827. Moulding plastic substances. HONEYWELL Inc. 25 April, 1969 [6 May, 1968], No. 21150/69. Heading B5A. [Also in Division H1] An electronic component is mounted on a sheet-like support by forming a perforation in the support, placing one face of the support against a surface composed of a "mould-release" material, inserting the component in the perforation so that its terminals lie against the mould-release surface, filling the remainder of the perforation with a hard-cure plastics material to secure the component and removing the support from the mould release surface when the plastics material has cured. As shown, Fig. 3, a ceramic circuit board 1 is placed on a plate 5 the upper surface 7 of which is coated with a mould-release material such as P.T.F.E., an integrated circuit chip 2 is arranged in a perforation in the circuit board and is retained by a positioning device 6 while the perforation is filled with epoxy resin 3 which is cold or hot cured. The assembly is then removed from the plate 5 and conductive tracks (4), e.g. of Al, are vapour deposited or sprayed through a mask to connect the terminals of the chip to conductive lands on the circuit board. The complete assembly may be coated with epoxy resin. The chip may also be positioned in the aperture by means of a sheet of transparent plastics material to which it is temporarily adhered, the sheet acting as the mould-release surface, and the chip may comprise a transistor or a resistor or capacitor instead of an integrated circuit. The support may comprise a thick or thin film circuit or a metal lead frame.</p> |
