| 摘要 |
<p>Heat resistant resins, soluble in low-boiling solvents (acetone, etc.) with excellent adhesion to metal or plastics, suitable for use in microcircuitry obtained by reacting a N, N-bis-imide of an unsatd carboxylic acid (R is divalent phenyl or two phenyl groups linked via, O, CH2 or S-S; R' is H or a 1-4C alkyl residue) with an o-, m- or p-xylelenediamine, at a rate of 0.1-0.6 mol diamine per mol. bis-imide. The reaction is carried out with warming in a low-boiling solvent.</p> |
