| 摘要 |
PROBLEM TO BE SOLVED: To provide a reliable mounting structure of a semiconductor multi-chip module which can efficiently radiate a large quantity of heat generated from the module based only on heat conduction. SOLUTION: In the mounting structure of a multi-chip module, a heat conductive sheet 4 applied onto a rear side of a chip size package(CSP) 1 is contacted with a metallic radiator 3, metallic radiator plates 9 are inserted into heat- diffusing grooves 12 made in the metallic radiator 3, and then screwed to metallic radiating poles 5 erected on a CSP-mounting side of a printed circuit board 8. A copper foil pattern 6a is thermally coupled with another copper foil pattern 6b on the other surface of the board 8 through through-holes 7 of the board 8. The pushing pressure of the radiator 3 and conductive sheet 4 can be adjusted freely by means of spacers 10 provided to the poles 5. Thus the generation of a thermal/mechanical pulling stresses with respect to metallic bumps between the CSP 1 and CSP mounting board 2 can be prevented beforehand. |
