| 摘要 |
PURPOSE:To facilitate aging of a semiconductor device on a mother chip before packaging by providing source system electrodes on the mother chip. CONSTITUTION:The wiring of a printed board 27 and a mother chip 2 connected to one unit of a wiring tape 17 are electrically connected by a socket 28 which is an aging jig. The socket 28 has a resin board 30 of a predetermined shape which has pins 29 inserted into electrode holes of the board 27 on its back surface and has bump electrodes 31 which are electrically connected to the pins 29 by through-hole wirings 32 on its top surface. The mother chip 2 is held and fixed between the resin board 30 and a pressing board 34 and at the same time electrically connected. With this constitution, power for aging can be supplied to the semiconductor pellet 4 attached to the mother chip 2 from a source 26. |
