发明名称 THERMOSETTING RESIN COMPOSITION
摘要 PURPOSE:To obtain the subject composition, having a low viscosity before curing and excellent in heat resistance and further crack resistance after the curing by using and blending a coupling agent capable of molecularly entangling with an organic matrix resin and chemically bonding to an inorganic filler and coupling agent chemically bondable to both the above-mentioned components in combination. CONSTITUTION:A thermosetting resin composition obtained by blending (A) an organic matrix resin consisting of a polyfunctional epoxy compound, etc., with (B) an inorganic filler and (C) a coupling agent consisting of (C1) a titanate based coupling agent expressed by formula I (n is 2 or 3; R is methyl, etc.; R' is long-chain alkyl) and (C2) a silane based coupling agent expressed by formula II (X is functional group, such as epoxy groups, reactive with the matrix resin at the terminal). The coupling agent (C1) is molecularly entangled with the component (A) in an amount of 0.05-2wt.% based on the component (B) and chemically bonded to the component (B). The coupling agent (C2) is chemically bonded to the component (A) in an amount of 0.05-2wt.% based on the component (B).
申请公布号 JPH01259066(A) 申请公布日期 1989.10.16
申请号 JP19880085109 申请日期 1988.04.08
申请人 HITACHI LTD 发明人 KOYAMA TORU;TAKASAKI HIROKAZU;ASANO HIDEKI;KUBO HIROBUMI;FUJIMORI TOSHIYUKI
分类号 C08L63/00;C08G59/00;C08K3/00;C08K5/00;C08K9/04;C08K13/02;C08L83/04;C08L101/00;H01L23/29;H01L23/31 主分类号 C08L63/00
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