| 摘要 |
PURPOSE:To improve the tight adhesiveness between an electronic part and polyaryene lsulfide resin and to improve reliability by a method wherein triazine thiol is provided on the interface between the electronic part and the polyarylene sulfide resin. CONSTITUTION:After a 16-pin IC lead frame, consisting of a copper alloy, has been dipped into the methanol solution of sodium salt of dimethylaminotriazinediol, the lead frame is pulled up, methanol solution is evaporated, and a traizimethiol treatment is conducted. On the other hand, after glass fiber has been mixed to polyarylene sulfide, polyarylene sulfide resin is melted, kneaded, and pelletized. The lead frame, which is triazinthiol- treated using said polyarylene sulfide resin, is sealed. Through these procedures, the tight adhesiveness of the lead frame and the polyarylene sulfide resin can be improved, and reliability can also be improved. |
