| 发明名称 |
FOERFARANDE FOER YTFOERENING AV KISELHALVLEDARSKIVOR. |
| 摘要 |
Process for the surface bonding of two or more silicon semiconductor wafers (1) under the effect of pressure and heat, a thin layer (2, 3) of semiconductor-conforming material being applied to at least one of the surfaces to be joined. <IMAGE> |
| 申请公布号 |
FI920422(A0) |
申请公布日期 |
1992.01.30 |
| 申请号 |
FI19920000422 |
申请日期 |
1992.01.30 |
| 申请人 |
MESSERSCHMITT-BOELKOW-BLOHM GMBH |
发明人 |
SCHUSTER, GUENTHER;PAENITSCH, KLAUS |
| 分类号 |
H01L21/02;H01L21/98;(IPC1-7):H01L/ |
主分类号 |
H01L21/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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