| 摘要 |
PROBLEM TO BE SOLVED: To reduce manufacturing man-hours and to reduce manufacturing facility, in a circuit board where a plurality of circuit chips and a shielding case are soldered. SOLUTION: In a first process, a first cream solder pattern, to which the plurality of circuit chips 2 are to be bonded and a second cream solder pattern 8 to which a shielding frame body 31 is to be bonded, are formed on the surface of a board 4. In a second process, the plurality of circuit chips 2 are mounted on the first cream solder pattern and the shielding frame body 31 is mounted on the second cream solder pattern 8 in a state in which the shielding frame body 31 is engaged with a frame-like jig 5. In a third process, a collective reflow treatment is executed on the board 4. In a fourth process, the jig 5 is removed from the shielding frame body 31, and a shielding cover is fitted to the shielding frame body 31 so as to obtain the circuit board. |
