发明名称 FLOAT POLISHING DEVICE
摘要 PURPOSE:To polish the surface of a work into a specular surface with high flatness and without distortion even if it has a large aperture by specifying a ratio of width dimension of a recessed part to width dimension of a protruded part as well as specifying depth of the recessed part of irregularity formed on the upper surface of a polishing plate. CONSTITUTION:By rotating a polishing plate 3, supplying a polishing liquid 6 on it, floating a work W by fluid pressure of the polishing liquid 6 and rotating and oscillating the work W, the surface of the work W is polished without contact. On the upper surface of the polishing plate 3, a groove is formed spiral by diamond machining. A ratio of width dimension of the recessed and protruded parts 7, 8 formed on the upper surface of this polishing plate 3 is set as 1:0.8-1:1.2, and the depth of the recessed part 7 is set as 0.2-0.3mm respectively. Consequently, it is possible to polish the surface of a work with large aperture into a specular surface with high flatness and without distortion.
申请公布号 JPH0796450(A) 申请公布日期 1995.04.11
申请号 JP19930244106 申请日期 1993.09.30
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 HIRATA TERUTO;OGAWA TETSUO;TOYOSHIMA YOSHIHARU
分类号 B24B1/00;B24B37/04 主分类号 B24B1/00
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