| 摘要 |
The present invention is directed to methods for preparing devices having hollow metallic microchannels (20) on a surface of a planar substrate (10). More specifically, the present invention is directed to methods for preparing devices having surface metallic microchannels with a range of widths and heights selected to provide efficient flow characteristics and having thick and, thus, strong and durable channel walls. In addition, the methods of the present invention are compatible with standard integrated circuit fabrication techniques and, because the microchannels (20) are formed upon the surface of the substrate (10) without degrading the surface planarity, these techniques can be used to incorporate electronic circuitry into the microchannel-containing devices. For purposes of this application, the term "microchannel" refers to enclosed or partially enclosed channels having heights within the range from about 2 to about 200 micrometers ( mu m) and widths within the range of about 10 micrometers to about 2 millimeters.
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