| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a flip-chip bonding structure in which a semiconductor integrated circuit chip is mounted directly on a flexible printed circuit board, and a manufacturing method therefor. SOLUTION: In the structure, a metallic material 7 is pasted on the opposite side to the mounting surface of a flexible printed circuit board 4 on which a semiconductor integrated circuit chip 1 is mounted. The chip is flip-chip bonded on the board with ultrasound using a resin 5 directly below the position where the chip is mounted and an adhesive tape 6 other than directly below the position where the chip is mounted, as the material for pasting the circuit board on the metallic material.</p> |
