| 摘要 |
PURPOSE: A semiconductor package with a high heat spreader structure is provided to maximize a heat spreader effect without additionally attaching the heat spreader by expanding a heat radiation path at minimum cost. CONSTITUTION: The pad part of a semiconductor leadframe made of a plurality of columns is connected by a tie bar to protrude to the inclined surface of a package. A protrusion or a hook is formed in a damber connected to the pad part and the tie bar so that a semiconductor leadframe has a structure for easily coupling a heat spreading structure. The protrusion part has a structure protruding upward or downward with respect to the package. |
