A CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

A chip package and its manufacturing method are provided to simplify manufacturing processes by omitting an aligning process on each chip package using an improved lid fixing structure. A chip package includes a package body and a chip module. The package body(215) includes a concavity(205) with a stepped portion and a signal line(210) in the concavity. The chip module(220) includes a chip and a circuit pattern layer(235) for inducing an electrical signal between the signal line and the chip. The chip module is stably loaded onto a stepped portion of the concavity to seal completely the concavity.