发明名称 COOLING MEDIUM CIRCULATION SYSTEM OF SEMICONDUCTOR MANUFACTURING APPARATUS
摘要 A coolant circulating apparatus of semiconductor device manufacturing equipment is provided to prevent the stopping of equipment operation due to a component replacing process by using a variety of circulation paths. A coolant circulating apparatus supplies a coolant to semiconductor device manufacturing equipment to control properly the temperature of the equipment. The coolant circulating apparatus includes a first circulation path, a second circulation path, first and second valves, a third circulation path, and check valve. The first circulation path(110) includes a first flowmeter(112) for checking the flow rate of a coolant and a first filter(114). The second circulation path(120) includes a second flowmeter(122) and a second filter(124). The first and the second valves are installed on the first and the second circulation paths to select one out of the first and the second circulation paths. The third circulation path(150) is used for supplying the coolant provided from the selected circulation path to semiconductor device manufacturing equipment. The check valve(160) is used for exhausting the coolant from the equipment.
申请公布号 KR20060132245(A) 申请公布日期 2006.12.21
申请号 KR20050052482 申请日期 2005.06.17
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, DONG SEOK
分类号 H01L21/00 主分类号 H01L21/00
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