| 摘要 |
A thermocouple device of a semiconductor device manufacturing vertical diffusion furnace is provided to prevent the damage of an inner thermocouple by fixing stably the inner thermocouple using a thermocouple fixing part. A manifold(50) is used for supporting lower portions of inner and outer tubes(20,30). A thermocouple insertion hole(50c) is formed at a sidewall of the manifold. An inner thermocouple(60) is inserted into the thermocouple insertion hole. A thermocouple fixing part(56) is protruded from an inner surface of the manifold to enclose partially the inner thermocouple, so that the inner thermocouple is stably fixed to the resultant structure.
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